Plating specifications also designate the base coating to be applied under the silver plate. The thickness of coatings can range from 1 micron for short-term shelf life and solderability, to 10 microns for thermo-compression bonding and die attachment, and up to 40 microns for severe wear resistance applications. Other factors addressed in silver-plating specifications include the purity of silver, hardness, conductivity and solderability requirements and methods for testing adhesion.

Plating with Silver provides performance, strength, and functionality. Silver plating provides the critical benefits of solderability and electric conductivity for use in high tech applications. Plus, silver plating is quiet resistant to corrosion and does not oxidize easily, but will form a surface tarnish of silver sulfide. Of all the metals, Silver is the best conductor of electricity.
 
In electroplating, silver is primarily used for industrial applications: electrical connectors & contacts, batteries, medical instrument, semiconductor, telecom, pharmaceutical & automotive industries, jewelry and dinnerware industries. Silver is harder than gold but softer than copper.
 
Pure silver, (Chemical symbol Ag) has a brilliant white metallic luster. It is a little harder than gold and is very ductile and malleable. Pure silver has the highest electrical and thermal conductivity of all metals, and possesses the lowest contact resistance. It is stable in pure air and water, but tarnishes when exposed to ozone, hydrogen sulfide, or air containing sulfer.